ALEXANDRIA, Va., May 5 -- United States Patent no. 12,619,144, issued on May 5, was assigned to DONGJIN SEMICHEM Co. LTD. (Incheon, South Korea).
"Positive photosensitive resin composition" was invented by Hyoc Min Youn (Hwaseong-si, South Korea), Tai Hoon Yeo (Hwaseong-si, South Korea), Gi Seon Lee (Hwaseong-si, South Korea), Bong Hee Kim (Hwaseong-si, South Korea) and Dong Myung Kim (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A positive photosensitive resin composition includes a polymer resin, a quinonediazide compound, and a solvent. The polymer resin includes (i) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 1, ii) 5 to 95 wt. % of a ...