ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,436, issued on Sept. 1, was assigned to DISCO Corp. (Tokyo).
"Wafer processing method" was invented by Tomoharu Takita (Tokyo) and Hayato Kiuchi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method for processing a wafer which has one side in which a circular recessed portion is formed in a region surrounded by an annular protruding portion is performed by a thermocompression bonding apparatus including a first recessed portion, a second recessed portion, and a holding table that is disposed on the second recessed portion. In the method, the wafer the one side of which is oriented upward is held from a lower side by the ho...