US Patent Issued to DISCO on Sept. 1 for "Processing method of wafer" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,445, issued on Sept. 1, was assigned to DISCO Corp. (Tokyo).

"Processing method of wafer" was invented by Akira Mizutani (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processing method of a wafer includes a modified layer forming step of irradiating the wafer, from its back surface, with a laser beam of a wavelength having transmissivity for the wafer with its focal point positioned inside a boundary portion between an effective area and a chamfered portion, whereby a modified layer is formed along the chamfered portion, a chamfered portion removing step of applying an external force to an outer periphery of the wafer, and grinding the bac...