US Patent Issued to DISCO on Oct. 6 for "Wafer grinding method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,389, issued on Oct. 6, was assigned to DISCO Corp. (Tokyo).

"Wafer grinding method" was invented by Kenji Takenouchi (Tokyo), Mitsutane Kokubu (Tokyo), Masayoshi Teramoto (Tokyo) and Koichi Kunimoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer grinding method for grinding, by a grindstone, a reverse side of a wafer formed on a face side thereof with devices includes a protective member forming step of covering a whole area of the face side of the wafer with a protective member, a holding step of holding the wafer by a chuck table with the protective member therebetween, and a grinding step of grinding the reverse side of the wafer by...