ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,471, issued on May 19, was assigned to DISCO Corp. (Tokyo).
"Method of laying protective sheet and protective sheet" was invented by Koshiro Suzuki (Tokyo), Masamitsu Kimura (Tokyo), Hideji Horita (Tokyo), Yuya Tanaka (Tokyo), Takashi Nakahara (Tokyo) and Norihisa Arifuku (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of laying a protective sheet on a face side of a wafer includes preparing a first protective sheet having, on one surface thereof, a non-adhesive portion to be coextensive with a device region of the wafer and an adhesive portion to be positioned along an outer circumferential excessive region of the wafer, affixing the ...