ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,638, issued on March 31, was assigned to DISCO Corp. (Tokyo).
"Device wafer processing method" was invented by Naoko Yamamoto (Tokyo) and Shunsuke Teranishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device wafer processing method includes a protective film coating step of coating a face side of a device wafer with a protective film, a laser processing step of applying a laser beam having a wavelength absorbable by the device wafer to the device wafer along streets and forming laser processing grooves that divide a device layer, a tape affixing step of affixing a tape to the protective film on the device wafer, a holding step of holdin...