US Patent Issued to DISCO on March 17 for "Processing method of wafer removing peripheral portion of wafer" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,885, issued on March 17, was assigned to DISCO Corp. (Tokyo).

"Processing method of wafer removing peripheral portion of wafer" was invented by Satoshi Kobayashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer is processed by causing a cutting blade to cut into an outer circumferential surplus region of a first wafer from the front surface side by a predetermined thickness and executing cutting along the outer circumferential edge to form an annular step part in the outer circumferential surplus region, bonding the front surface side of the first wafer and the front surface side of a second wafer to form a bonded wafer, forming an ann...