US Patent Issued to DISCO on June 3 for "Method of manufacturing layered device chip assembly" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,655, issued on June 3, was assigned to DISCO Corp. (Tokyo).

"Method of manufacturing layered device chip assembly" was invented by Shunsuke Teranishi (Tokyo), Zhiwen Chen (Tokyo), Kyosuke Kobinata (Tokyo) and Akihito Kawai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a layered device chip assembly includes forming first grooves in a first wafer, fixing the first wafer to a support body, grinding the first wafer to expose the first grooves, forming a first resin layer in the first grooves, simultaneously polishing the first wafer and the first resin layer to expose the first resin layer, forming second grooves in the...