ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,019, issued on Dec. 2, was assigned to DISCO Corp. (Tokyo).
"Method of processing wafer and laser applying apparatus" was invented by Kentaro Odanaka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a wafer includes removing a functional layer on projected dicing lines, thereby exposing a substrate, and cutting the wafer along the projected dicing lines where the substrate is exposed, thereby fabricating individual device chips. A laser applying apparatus includes a beam branching unit for branching a laser beam spot into at least two slender spots spaced from each other in a processing direction along the projected dicing...