US Patent Issued to DISCO on Dec. 16 for "Substrate processing method including a burr removing process" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,123, issued on Dec. 16, was assigned to DISCO Corp. (Tokyo).

"Substrate processing method including a burr removing process" was invented by Tomohiro Kano (Tokyo) and Kenji Takenouchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for processing a substrate having a metal formed on a planned dividing line along the planned dividing line, the method including a processed groove forming step of forming a processed groove in the substrate along the planned dividing line, and a burr removing step of, after the processed groove forming step is performed, making an etchant that includes at least an oxidizing agent and to which ...