ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,693, issued on April 14, was assigned to DISCO Corp. (Tokyo).
"Method of manufacturing chips" was invented by Takumi Kohei (Tokyo) and Suguru Hiraiwa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a plurality of chips by dividing a workpiece having a substrate harder than a monocrystalline Si substrate includes a cut groove forming step of, while holding the workpiece on a holding table with a surface of the workpiece being exposed, cutting the workpiece along each of projected dicing lines with a first cutting blade as it is vibrating at a frequency in the ultrasonic band, to form a cut groove in the workpiece such...