US Patent Issued to Diodes on April 21 for "Lead frame, packaging structure and packaging method" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,828, issued on April 21, was assigned to Diodes Inc. (Plano, Texas).

"Lead frame, packaging structure and packaging method" was invented by MeiDan Dong (Shanghai), Fang Tang (Shanghai) and Wenge Chen (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame includes a base comprising a bearing surface for bearing a chip. The bearing surface includes a soldering region, with a solder layer arranged in the soldering region. The solder layer is configured for fixing the chip on the bearing surface. The lead frame includes a groove provided on the bearing surface in a thickness direction of the base. The groove is located outside the solder...