US Patent Issued to Diodes, Shanghai Kaihong Technology, Diodes Technology (Chengdu), Shanghai Kaihong Electronic on May 26 for "Wire bonder and gas pipe connector therefor" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,125, issued on May 26, was assigned to Diodes Inc. (Plano, Texas), Shanghai Kaihong Technology Co. Ltd. (Shanghai), Diodes Technology (Chengdu) Co. Ltd. (Chengdu, China) and Shanghai Kaihong Electronic Co. Ltd. (Shanghai).

"Wire bonder and gas pipe connector therefor" was invented by Huaigang Zhang (Chengdu, China) and Chris Wang (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connector for connecting a gas pipe and a heating component of a wire bonder includes a first connection end for connecting the connector to the heating component, and a second connection end for connecting the connector to the gas pipe. A heat-insulation tube ...