US Patent Issued to DIC on Nov. 3 for "Transfer laminate and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,180, issued on Nov. 3, was assigned to DIC Corp. (Tokyo).

"Transfer laminate and manufacturing method therefor" was invented by Wataru Fujikawa (Takaishi, Japan), Norimasa Fukazawa (Takaishi, Japan), Hiroyuki Hagiwara (Takaishi, Japan) and Rei Tamura (Takaishi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The layered body includes a seed layer that serves as a base for plating and that can be formed using a simple and low-cost method capable of ensuring stable quality and preventing the occurrence of scratches on the plating seed layer due to contact with a coating apparatus during application and contact with conveyor rollers. The layered bo...