US Patent Issued to DIC on Aug. 25 for "Particle-containing resin composition and molded product" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,978, issued on Aug. 25, was assigned to DIC Corp. (Tokyo).

"Particle-containing resin composition and molded product" was invented by Akihiro Koike (Sakura, Japan), Yusuke Kano (Sakura, Japan), Shingo Takada (Sakura, Japan) and Jianjun Yuan (Sakura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a particle-containing resin composition having an appropriate particle size and being capable of improving friction and wear resistance properties even under a high temperature and high load environment. The particle-containing resin composition according to the present invention includes a resin composition and molybdenum disulfide particl...