US Patent Issued to DENSO on Nov. 25 for "Semiconductor device, semiconductor module, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,714, issued on Nov. 25, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor device, semiconductor module, and method for manufacturing semiconductor device" was invented by Seigo Oosawa (Kariya, Japan) and Yasushi Ookura (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a sealing material, and an extension wire. The semiconductor element has, on a front surface, a first electrode pad and at least one second electrode pad, and generates a current in a direction connecting the front surface and a back surface. The sealing material is made of an insulating resin material and c...