US Patent Issued to DENSO on June 2 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,174, issued on June 2, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device" was invented by Atsuya Akiba (Kariya-city, Japan), Yuichi Takeuchi (Kariya-city, Japan), Kazuki Arakawa (Kariya-city, Japan), Yusuke Hayama (Kariya-city, Japan), Yasushi Urakami (Kariya-city, Japan), Shinichiro Miyahara (Kariya-city, Japan) and Tomoo Morino (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a second deep layer between a first deep layer and first current distribution layer and a base region in an active region and in a part of an inactive region adjacent to the active region. The second deep ...