US Patent Issued to DENSO on Feb. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,576, issued on Feb. 3, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor device" was invented by Yasushi Furukawa (Kariya, Japan), Hirohito Fujita (Kariya, Japan), Tetsuto Yamagishi (Kariya, Japan) and Atsuya Akiba (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor device, a first wiring member is electrically connected to a first main electrode on a first surface of a semiconductor element, and a second wiring member is electrically connected to a second main electrode on a second surface of the semiconductor element. An encapsulating body encapsulates at least a part of each of the first and second wiring mem...