US Patent Issued to DENSO on Feb. 10 for "Inspection apparatus and inspection method for semiconductor substrate" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,726, issued on Feb. 10, was assigned to DENSO Corp. (Kariya, Japan).

"Inspection apparatus and inspection method for semiconductor substrate" was invented by Junichi Uehara (Kariya, Japan) and Koji Eguchi (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inspection apparatus includes a light source that generates and emits light to a substrate to be inspected, a lens that captures the light emitted to and reflected by the substrate, a detection unit that detects the light captured by the lens, and a determination unit that calculates a reflectance of light of the substrate based on an intensity of the light generated by the light sour...