US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, HAMAMATSU PHOTONICS on July 28 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,697, issued on July 28, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Nisshin, Japan) and HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Semiconductor device and method of manufacturing the same" was invented by Takashi Ushijima (Nisshin, Japan), Masatake Nagaya (Nisshin, Japan), Daisuke Kawaguchi (Hamamatsu, Japan) and Keisuke Hara (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes irradiation of laser on a semiconductor substrate and cutting of the semiconductor substrate. The laser is irradiated on the semicon...