ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,783, issued on April 21, was assigned to DENSO Corp. (Kariya-city, Japan) and SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Method for manufacturing soldered products" was invented by Kei Endo (Kariya-city, Japan), Kazuyuki Hamamoto (Kariya-city, Japan), Hisashi Tokutomi (Tokyo), Motohiro Onitsuka (Tokyo) and Yoko Kurasawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a soldered product by soldering a solder object portion, including: a solder supplying step that causes a cylindrical soldering iron having a through hole to contact with the solder object portion to supply a thread solder piece to the solder object portio...