US Patent Issued to Delta Electronics on June 16 for "Stepped mesh-stacked powder-filling structure and vapor chamber using same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,656,066, issued on June 16, was assigned to Delta Electronics Inc. (Taoyuan City, Taiwan).

"Stepped mesh-stacked powder-filling structure and vapor chamber using same" was invented by Wen-Shiang Chen (Taoyuan City, Taiwan) and Yuan-Chia Chung (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stepped mesh-stacked powder-filling structure is disclosed and includes a cover plate, a first mesh plate, a second mesh plate and a wick structure. The first mesh plate is stacked on an inner surface of the cover plate along a first direction, and includes a first through opening. The second mesh plate is stacked on the first mesh plate along t...