ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,027, issued on Sept. 15, was assigned to Delta Electronics (Shanghai) Co. Ltd. (Shanghai).
"Power element assembly structure" was invented by Qunbo Zheng (Shanghai), Linfeng Zhong (Shanghai), Junhao Xia (Shanghai), Tengshen Zhang (Shanghai), Jinfa Zhang (Shanghai) and Yuanyuan Song (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a power element assembly structure, including a main board, a first heat sink, a second heat sink, an insulating support, a power element, an insulating thermally conductive layer, and a fixture; where a first end of the insulating support is connected to the main board, a second end of the insulating s...