US Patent Issued to Dell Products on May 12 for "Dimple on circuit board for providing standoff between circuit board and circuit package" (Texas Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,270, issued on May 12, was assigned to Dell Products LP (Round Rock, Texas).

"Dimple on circuit board for providing standoff between circuit board and circuit package" was invented by Earl Boone (Round Rock, Texas), James L. Petivan (Austin, Texas), Wallace H. Ables (Georgetown, Texas) and Steven R. Ethridge (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An information handling resource may include a circuit board comprising an electrically-conductive pad and a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board."

The patent was filed on Nov. 6...