US Patent Issued to Deeia on March 17 for "Metallic thermal interface materials and associated devices, systems, and methods" (American, Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,622, issued on March 17, was assigned to Deeia Inc. (Saratoga, Calif.).

"Metallic thermal interface materials and associated devices, systems, and methods" was invented by Himanshu Pokharna (Saratoga, Calif.) and Gin Hwee Tan (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60deg C. and about 90de...