US Patent Issued to Deca Technologies USA on May 13 for "Fully molded structure with multi-height components comprising backside conductive material and method for making the same" (California, Washington, Arizona, Minnesota Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,561, issued on May 13, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Fully molded structure with multi-height components comprising backside conductive material and method for making the same" was invented by Clifford Sandstrom (Richfield, Minn.), Paul R. Hoffman (San Diego), Robin Davis (Vancouver, Wash.) and Timothy L. Olson (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive mate...