US Patent Issued to Deca Technologies USA on Dec. 16 for "Encapsulant-defined land grid array (LGA) package and method for making the same" (California, Washington, Minnesota, Arizona Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,197, issued on Dec. 16, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Encapsulant-defined land grid array (LGA) package and method for making the same" was invented by Robin Davis (Vancouver, Wash.), Craig Bishop (Scottsdale, Ariz.), Paul R. Hoffman (San Diego) and Clifford Sandstrom (Richfield, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and related structure for a encapsulant defined land grid array (LGA) may comprise a semiconductor chip comprising conductive studs disposed over an active layer of the semiconductor chip, and a first encapsulant disposed around at least a portion of sidewalls of the conductive studs...