US Patent Issued to Deca Technologies USA on Aug. 4 for "Method of making a fan-out semiconductor assembly with an intermediate carrier" (Arizona, California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,077, issued on Aug. 4, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Method of making a fan-out semiconductor assembly with an intermediate carrier" was invented by Timothy L. Olson (Phoenix) and Paul R. Hoffman (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor assembly comprising an intermediate carrier which is not an interposer and does not comprise electrical routing in or on the intermediate carrier, a plurality of components disposed over the intermediate carrier such that an active surface of the plurality of components is oriented away from the intermediate carrier, where the plurality of components have ...