US Patent Issued to DAIHEN on May 12 for "Plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,891, issued on May 12, was assigned to DAIHEN Corp. (Osaka, Japan).

"Plasma processing apparatus" was invented by Ryoji Tamaki (Osaka, Japan), Hayato Notomi (Osaka, Japan), Shigeki Amadatsu (Osaka, Japan) and Shinichi Hasegawa (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma processing apparatus includes: an inner electrode; an electrode holder; an outer electrode; an insulating member that surrounds the inner electrode and the electrode holder; a fin member for forming a swirling flow around the inner electrode by causing a process gas supplied to an inner side of the insulating member to swirl; and a nozzle that blows the swirl...