US Patent Issued to DAICEL on Dec. 16 for "Monomer, resin for photoresist, resin composition for photoresist, and pattern forming method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,638, issued on Dec. 16, was assigned to DAICEL Corp. (Osaka, Japan).

"Monomer, resin for photoresist, resin composition for photoresist, and pattern forming method" was invented by Akira Eguchi (Tokyo), Kazuhiro Uehara (Tokyo), Masayoshi Furukawa (Tokyo) and Takashi Maruyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a monomer that improves solubility in organic solvents, hydrolyzability, and solubility in water after hydrolysis of a resin as well as imparts higher heat resistance to a resin. A resin for a photoresist containing a polymerization unit represented by Formula (Y), wherein Rh represents a halogen atom or an alkyl ...