US Patent Issued to Dai Nippon Printing on Oct. 27 for "Wiring board and method for manufacturing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,572, issued on Oct. 27, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Wiring board and method for manufacturing wiring board" was invented by Koichi Suzuki (Tokyo-to, Japan), Seiji Take (Tokyo-to, Japan) and Daisuke Matsuura (Tokyo-to, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate...