US Patent Issued to Dai Nippon Printing on March 31 for "Wiring board and method for manufacturing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,395, issued on March 31, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Wiring board and method for manufacturing wiring board" was invented by Koichi Suzuki (Tokyo), Seiji Take (Tokyo) and Daisuke Matsuura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding u...