US Patent Issued to D2S on Oct. 6 for "Mask optimization for layer accounting for overlap with other layers" (California Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,471, issued on Oct. 6, was assigned to D2S INC. (San Jose, Calif.).

"Mask optimization for layer accounting for overlap with other layers" was invented by Donald Oriordan (Sunnyvale, Calif.) and Akira Fujimura (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments provide a method for optimizing a mask layout generated from a design layout of an integrated circuit (IC). The method generates, based on a first mask layout, a simulated wafer image having predicted manufactured shapes representing IC components that are to be manufactured on a first layer of the IC. The method identifies a cross-sectional overlap between a firs...