US Patent Issued to D-WAVE SYSTEMS on March 31 for "Thermally isolating cabling assemblies, systems using thermally isolating cabling assemblies, and methods of fabricating thermally isolating cabling assemblies" (Canadian Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,029, issued on March 31, was assigned to D-WAVE SYSTEMS INC. (Burnaby, Canada).

"Thermally isolating cabling assemblies, systems using thermally isolating cabling assemblies, and methods of fabricating thermally isolating cabling assemblies" was invented by Richard D. Neufeld (Burnaby, Canada), Surjit Singh Dhesi (Richmond, Canada) and Oscar Yui-kit Fung (Richmond, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "Cable assemblies and, systems using the assemblies can include thermal breaks between assembly sections, and methods for fabricating the assemblies can include creating thermal breaks. A cable assembly includes a first shielding cable...