US Patent Issued to CYNTEC on Jan. 27 for "Magnetic component structure with thermal conductive filler" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,127, issued on Jan. 27, was assigned to CYNTEC Co. LTD. (Hsinchu, Taiwan).

"Magnetic component structure with thermal conductive filler" was invented by Chun-Tiao Liu (Hsinchu, Taiwan), Hsieh-Shen Hsieh (Hsinchu, Taiwan), Shao-Wei Chang (Hsinchu, Taiwan) and Jinping Zhou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structur...