US Patent Issued to Cummins on Sept. 9 for "Enclosure assemblies, and related devices and methods" (Indiana, Minnesota Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,223, issued on Sept. 9, was assigned to Cummins Inc. (Columbus, Ind.).

"Enclosure assemblies, and related devices and methods" was invented by Vineet K. Pandey (Columbus, Ind.), William B. Fields (Seymour, Ind.), Isreal I. Llaguno (Columbus, Ind.), Bharadwaj Ramakrishnan (Bargersville, Ind.), Bradford K. O. Palmer (Ham Lake, Minn.), Jaydeep V. Patel (Fishers, Ind.), Michael Hays (Columbus, Ind.), Dakshina S. Murthy-Bellur (Plymouth, Minn.), Amir Tajuddin Tamboli (Columbus, Ind.) and Rohit Saha (Columbus, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling plate assembly for dual-sided cooling, the cooling plate assembly can include a firs...