US Patent Issued to CSP TECHNOLOGIES on Sept. 8 for "Blister packages containing active material and methods of making and using same" (American, German Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,073, issued on Sept. 8, was assigned to CSP TECHNOLOGIES INC. (Auburn, Ala.).

"Blister packages containing active material and methods of making and using same" was invented by Craig Voellmicke (Auburn, Ala.) and Ralf Kibele (Holzkirchen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A blister pack having a backing having a first side and an opposing second side. Each of the first and second side is flat or planar. The blister pack can also include a cover having a first side and an opposing second side. At least a portion of the second side of the cover is adhered to the first side of the backing to form a sealed package for containing pro...