US Patent Issued to CreeLED on July 28 for "Mounting arrangements for semiconductor packages and related methods" (North Carolina Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,593, issued on July 28, was assigned to CreeLED Inc. (Durham, N.C.).

"Mounting arrangements for semiconductor packages and related methods" was invented by Timothy Ling (Raleigh, N.C.), Ryan Mohn (Mebane, N.C.), David N. Randolph (Wake Forest, N.C.), David Peoples (Raleigh, N.C.) and Wooh Jae Kim (Cary, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages and more particularly mounting arrangements for semiconductor packages and related methods are disclosed. Mounting arrangements include metal pads on substrates and selectively placed solder material on various portions of the metal pads. Semiconductor packages may be initiall...