ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,352, issued on Sept. 15, was assigned to CORNING Inc. (Corning, N.Y.).
"Foldable substrates and methods of making" was invented by Douglas Clippinger Allan (Corning, N.Y.), Yousef Kayed Qaroush (Painted Post, N.Y.), Steven S Rosenblum (San Jose, Calif.), Chuanche Wang (Horseheads, N.Y.) and Tingge Xu (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Foldable substrates comprise a substrate thickness from about 80 micrometers to about 2 millimeters. Foldable substrates comprise a first portion, a second portion, and a central portion positioned therebetween. The central portion comprises a central thickness from about 25 micrometers t...