ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,872, issued on May 26, was assigned to CORNING Inc. (Corning, N.Y.).
"Article and method for temporary bonding of substrates" was invented by Julia Anne Dorothee Brueckner (Nieder-Olm, Germany), Ya-Huei Chang (Zhudong Township, Taiwan), Kuan-Ting Kuo (Chubei, Taiwan), Prantik Mazumder (Ithaca, N.Y.) and Jian-Zhi Jay Zhang (Ithaca, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Articles and methods for temporary bonding of substrates are described. The articles include a photo-release layer to enable reversal of the temporary bonding upon exposure of the photo-release layer to light to separate the substrates. The method includes plasma treatment...