US Patent Issued to CORNING on March 17 for "Heat chamfering apparatus and method" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,142, issued on March 17, was assigned to CORNING Inc. (Corning, N.Y.).

"Heat chamfering apparatus and method" was invented by Bokyung Kong (Hwasung, South Korea), JooYoung Lee (Asan-si, South Korea), Byoung Hoon Moon (Seoul, South Korea) and Kwangje Woo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat chamfering method for a glass panel includes bringing a heater into contact with an edge of a glass panel by causing the heater to approach a chamfering start point, heat-chamfering the edge by moving the heater from the chamfering start point to a chamfering end point along a chamfering line, and bringing the heater into n...