ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,615, issued on Feb. 10, was assigned to CORNING Inc. (Corning, N.Y.).
"Heat chamfering apparatus and method" was invented by Bokyung Kong (Hwasung, South Korea), JooYoung Lee (Asan-si, South Korea), Byoung Hoon Moon (Seoul, South Korea) and Kwangje Woo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat chamfering apparatus. A support unit supports a glass panel. A heat chamfering unit heat-chamfers an edge of the glass panel by applying thermal shock thereto. The support unit includes a contact support portion supporting the glass panel while in contact with the glass panel and a base portion configured to support the conta...