US Patent Issued to Coretronic on Aug. 4 for "Light-emitting diode circuit substrate and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,838, issued on Aug. 4, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan).

"Light-emitting diode circuit substrate and manufacturing method thereof" was invented by Chun-Chi Hsu (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting diode circuit substrate including multiple light-emitting diode chips, a redistribution structure, and multiple bonding pads is provided. The light-emitting diode chips include multiple contacts. The redistribution structure is disposed on the light-emitting diode chips and in direct contact with the plurality of contacts. The plurality of bonding pads are disposed on the redistribution structu...