US Patent Issued to COOLER MASTER on May 26 for "Heat dissipation structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,245, issued on May 26, was assigned to COOLER MASTER Co. LTD. (New Taipei City, Taiwan).

"Heat dissipation structure" was invented by Chi-Chuan Wang (New Taipei City, Taiwan), Chang-Yu Hsieh (New Taipei City, Taiwan), Shan-Yin Cheng (New Taipei City, Taiwan) and Hsiang-Fen Chou (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally co...