US Patent Issued to CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) on Dec. 2 for "Surface density measurement method, surface density measurement system, and computer device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,160, issued on Dec. 2, was assigned to CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) Ltd. (Hong Kong).

"Surface density measurement method, surface density measurement system, and computer device" was invented by Liangjie Yan (Ningde, China) and Qian Wu (Ningde, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface density measurement method includes: obtaining a single-sided-electrode-plate transverse scan result by performing a ray source-based transverse scan on a single-sided electrode plate, where the single-sided-electrode-plate transverse scan result includes a blank zone scan result of a blank zone of the single-sided electrode plate a...