US Patent Issued to CONNECTEC JAPAN on Dec. 16 for "Method for forming wiring on semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,121, issued on Dec. 16, was assigned to CONNECTEC JAPAN Corp. (Myoko, Japan).

"Method for forming wiring on semiconductor device" was invented by Hiroshi Komatsu (Myoko, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming electroconductive elements into a pattern on a substrate, in which: recesses (3) in a printing plate (2) are filled with an electroconductive paste (4) containing a resin that is curable by active light rays, the active-light-curable-resin-containing electroconductive paste (4) including an active-light-curable resin for which the average particle diameter is set to 0.1-20 micro metre; the printing plate (2) i...