US Patent Issued to COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH IRGABUSATION on Sept. 22 for "Interconnection in an integrated multilayer thin-film electronic device" (Australian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,506, issued on Sept. 22, was assigned to COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH IRGABUSATION (Acton, Australia).

"Interconnection in an integrated multilayer thin-film electronic device" was invented by Doojin Vak (Victoria, Australia), Regine Chantler (Victoria, Australia) and Hasitha Weerasinghe (Victoria, Australia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first pa...