US Patent Issued to Commissariat a l'Energie Atomique et aux Energies Alternatives on Sept. 9 for "Method for transferring a layer from a source substrate to a destination substrate" (French Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,786, issued on Sept. 9, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris).

"Method for transferring a layer from a source substrate to a destination substrate" was invented by Julie Widiez (Grenoble, France) and Frank Fournel (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of transferring a layer from a source substrate to a destination substrate, comprising the following steps: a) activating a bonding surface of said layer and a bonding surface of the destination substrate, by ion etching of said surfaces, or by sputtering of a bonding material onto said surfaces; and b) after step a),...