US Patent Issued to Cloud Light Technology on Aug. 26 for "Fiber to silicon photonics assembly method with fiber retaining apparatus" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,325, issued on Aug. 26, was assigned to Cloud Light Technology Ltd. (Hong Kong, Hong Kong).

"Fiber to silicon photonics assembly method with fiber retaining apparatus" was invented by Wing Keung Mark Mak (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moi...