US Patent Issued to CJ CHEILJEDANG on Oct. 20 for "In-line dumpling molding system" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,765,563, issued on Oct. 20, was assigned to CJ CHEILJEDANG Corp. (Seoul, South Korea).

"In-line dumpling molding system" was invented by Bong Jin Jang (Seoul, South Korea), Se Jin Kim (Seoul, South Korea), Da Woon Jung (Seoul, South Korea), Soon Suk Bae (Asan-si, South Korea), Sang Cheol Kim (Asan-si, South Korea) and Yong Gyu Lee (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An in-line dumpling molding system is disclosed. The in-line dumpling molding system according to the present invention comprises: a dumpling wrapper cutting device, which cuts a supplied dough sheet to form dumpling wrappers; a dumpling-molding lower fold...